Structure defects and electrochemical study of copper processed by equal channel angular pressing
Written by sctunisie no commentsUltra-fine grained (UFG) pure copper of 99.99 wt.% purity has been successfully obtained at room temperature by Equal Channel Angular Pressing (ECAP), with the grain size about 200 nm after 2 passes. X-ray diffraction and Transmission Electron Microscopy (TEM) were used to characterize the microstructure evolution. The effect of ECAP passes on the electrochemical behavior of copper were investigated by potentiodynamic polarization test. The UFG copper display a higher corrosion resistance, despite the increase of the defect density, such as dislocations and grain boundaries.
R. Daly, M. Masmoudi
ECAP, X-ray diffraction profile analysis, TEM, potentiodynamic polarization, Corrosion
Pages: 183-190
